Global Industry Analysis And Market Trends Of Semiconductor Packaging Material Up to 2020

Semiconductor packaging material consists of material used for protecting electronic components such as ICs and semiconductors from external impact, corrosion and other similar factors. These materials are used in conjunction with various other advanced packaging technologies for packaging of integrated circuits and semiconductors.

Semiconductor packaging material can be classified in eight sub-types which include bonding wires, organic substrates, encapsulation resins, leadframes, die attach materials, ceramic packages, solder balls and thermal interface materials amongst others. The organic substrates accounts for the largest market share in semiconductor packaging material. Organic substrates are extensively used as base materials for semiconductor packaging. Bonding wires have been used widely as packaging material for semiconductors, but recently there has been a shift towards copper bonding wires for semiconductor packaging. The market for encapsulation resins is expected to witness strong growth in the next few years since encapsulation resins are relatively novel packaging materials. The semiconductor packaging materials are application specific and available across the globe. The various packaging technologies include GA, SOP, QFN, DFN, QFA and similar others which generally depends on the end-use.

The market for semiconductor packaging material is expected to witness strong growth in the next few years on account of explosive growth in communication and mobile computing devices such as tablets and smartphones across the globe. Growth in mobile devices is also anticipated to drive the demand for wafer level packages. With the continued growth in the mobile devices market the market for semiconductor packaging materials is expected to witness strong growth in the next few years. The increase in demand for semiconductor packaging material is expected to be in line with the growth in the electronics industry across the globe. The semiconductor packaging material market is currently concentrated in Asia Pacific due to vast electronic industry present in the region. With growing demand for electronics and mobile communication devices the demand for semiconductor packaging materials is also expected to witness robust growth in the next few years.

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Owing to the growing electronics industry in Asia-Pacific region and increased demand for mobile computing devices particularly in countries such as China, India Indonesia etc. the demand for semiconductor packaging material is anticipated to witness strong growth in these regions. Asia Pacific was the dominant market for semiconductor packaging material followed by Europe and North America. In North America, U.S was one of the largest markets for semiconductor packaging material. U.S economy has been recently recovered and has been close to pre-recession levels. Looking forward, the packaging industry in North America is expected to show stable growth in the next few years, which in turn is anticipated to drive the semiconductor packaging material market in this region. In Europe, Germany accounted for the largest market share followed by Italy, France and the U.K. The semiconductor packaging material market in North America and Europe is characterized by similar market conditions. In the Rest of the World (RoW), especially in countries such as Brazil, the market is expected to witness strong growth on account of increased demand for semiconductors from the electronics industry in this region.

Some of the Major Companies operating in the global semiconductor packaging material market are Hitachi Chemical Co. Ltd., BASF SE, Henkel AG & Company, Sumitomo Chemical Co. Ltd., Alent plc, and Kyocera Chemical Co. Ltd., among others.

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Rising Disposable Incomes in Global Stimulate Semiconductor Packaging Material Market

Transparency Market Research (TMR), A Market Intelligence And Research Firm, Has Published A Research Study On "Semiconductor Packaging Material Market".Semiconductor packaging materials refer to materials that are used for the protection of electronic components such as semiconductors and integrated circuits (ICs) from corrosion, external collision, and other harmful factors. The use of a host of advanced technologies on global semiconductor packaging materials market enables efficient and secure packaging of semiconductors and integrated circuits.

In present times, the burgeoning use of mobile communication devices such as tablets and smartphones is one of the major factors driving the semiconductor packaging material market. The functioning of these devices is based on a complex network of numerous semiconductors integrated for sending and receiving signals, which is the basis of communication for the devices. Thus, with the continued growth of the mobile devices market, the demand for semiconductor packaging materials will be on the rise in the coming years.

Currently, Asia Pacific is a major hub of the semiconductor packaging material market. The presence of some of the largest electronic corporations in the world in the region accounts for the large and well-established presence of the semiconductor packaging material market in Asia Pacific.In some of the countries in Asia Pacific, such as China, Indonesia, and India, the emerging middle class, which has a handsome chunk of disposable income to spend, is generally impulsive in its buying habits. Middle-class consumers readily trade old electronic devices for newer gadgets, which is consistently driving demand for electronic components for these devices. Thus, the semiconductor packaging material market is benefitted in the region.

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Among the regional markets for semiconductor packaging materials, Europe and North America follow Asia Pacific in terms of revenue. Europe and North America exhibit similar conditions in the semiconductor packaging material market. In North America, the U.S. is one of the largest markets for semiconductor packaging materials, with the U.S. economy recovering in recent years to reach close to the pre-recession economic levels.In Europe, Germany holds the largest market share in the semiconductor packaging material market, trailed by Italy, France, and the U.K.

Semiconductor packaging materials are of eight types, namely bonding wires, die attach materials, encapsulation resins, solder balls, leadframes, organic substrates, ceramic packages, and thermal interface materials. Currently, organic substrates comprise the largest product segment of the global market for semiconductor packaging materials. As a standard, bonding wires have been used for semiconductor packaging, but the trend is shifting towards copper bonding wires as observed in the recent past. However, the encapsulation resins segment of the market is expected to display strong growth in the semiconductor packaging material market due to their novelty and various benefits over other packaging materials.

On the basis of application, the use of semiconductor packaging materials is application-specific and adheres to certain standard specifications followed across the globe. Some of the packaging technologies used around the world are GA, QFN, QFA, SOP, DFN, and others that are dependent on the end use.Some of the companies that have a significant presence in the global semiconductor packaging material market are Hitachi Chemical Co. Ltd., Henkel AG & Company, Alent plc, BASF SE, Sumitmo Chemical Co. Ltd., and Kyocera Chemical Co. Ltd. amongst others.

About Us :

Transparency Market Research is a global market intelligence company, providing global business information reports and services. Our exclusive blend of quantitative forecasting and trends analysis provides forward-looking insight for thousands of decision makers. Our experienced team of Analysts, Researchers, and Consultants, use proprietary data sources and various tools and techniques to gather, and analyze information.

Our data repository is continuously updated and revised by a team of research experts, so that it always reflects the latest trends and information. With a broad research and analysis capability, Transparency Market Research employs rigorous primary and secondary research techniques in developing distinctive data sets and research material for business reports.