Semiconductor
packaging material consists of material used for protecting
electronic components such as ICs and semiconductors from external
impact, corrosion and other similar factors. These materials are used
in conjunction with various other advanced packaging technologies for
packaging of integrated circuits and semiconductors.
Semiconductor
packaging material can be classified in eight sub-types which include
bonding wires, organic substrates, encapsulation resins, leadframes,
die attach materials, ceramic packages, solder balls and thermal
interface materials amongst others. The organic substrates accounts
for the largest market share in semiconductor packaging material.
Organic substrates are extensively used as base materials for
semiconductor packaging. Bonding wires have been used widely as
packaging material for semiconductors, but recently there has been a
shift towards copper bonding wires for semiconductor packaging. The
market for encapsulation resins is expected to witness strong growth
in the next few years since encapsulation resins are relatively novel
packaging materials. The semiconductor packaging materials are
application specific and available across the globe. The various
packaging technologies include GA, SOP, QFN, DFN, QFA and similar
others which generally depends on the end-use.
The market for
semiconductor packaging material is expected to witness strong growth
in the next few years on account of explosive growth in communication
and mobile computing devices such as tablets and smartphones across
the globe. Growth in mobile devices is also anticipated to drive the
demand for wafer level packages. With the continued growth in the
mobile devices market the market for semiconductor packaging
materials is expected to witness strong growth in the next few years.
The increase in demand for semiconductor packaging material is
expected to be in line with the growth in the electronics industry
across the globe. The semiconductor packaging material market is
currently concentrated in Asia Pacific due to vast electronic
industry present in the region. With growing demand for electronics
and mobile communication devices the demand for semiconductor
packaging materials is also expected to witness robust growth in the
next few years.
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Owing to the growing
electronics industry in Asia-Pacific region and increased demand for
mobile computing devices particularly in countries such as China,
India Indonesia etc. the demand for semiconductor packaging material
is anticipated to witness strong growth in these regions. Asia
Pacific was the dominant market for semiconductor packaging material
followed by Europe and North America. In North America, U.S was one
of the largest markets for semiconductor packaging material. U.S
economy has been recently recovered and has been close to
pre-recession levels. Looking forward, the packaging industry in
North America is expected to show stable growth in the next few
years, which in turn is anticipated to drive the semiconductor
packaging material market in this region. In Europe, Germany
accounted for the largest market share followed by Italy, France and
the U.K. The semiconductor packaging material market in North America
and Europe is characterized by similar market conditions. In the Rest
of the World (RoW), especially in countries such as Brazil, the
market is expected to witness strong growth on account of increased
demand for semiconductors from the electronics industry in this
region.
Some of the Major
Companies operating in the global
semiconductor packaging material market are Hitachi Chemical Co.
Ltd., BASF SE, Henkel AG & Company, Sumitomo Chemical Co. Ltd.,
Alent plc, and Kyocera Chemical Co. Ltd., among others.
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