Leadframe is a thin
metal structure which is attached to semiconductors in package
assembly process. The leadframe is a part of semiconductor and IC
packaging. The main function of the leadframe is to carry the signal
from the die to the attached outer electronic fitment. According to
the utility and application the leadframe is molded into desired
structure. The growing application sectors of semiconductor and IC
packaging as well as increasing product categories within application
segments are the major factors which are going to benefit the
leadframe
market. The leadframe is considered to be an essential part
of electronics equipment.
The leadframe market
is primarily driven by the strong demand of electronics and
electrical in consumer electronics equipment. Growing usage of
equipment in day to day activities is expected to boost the demand of
consumer electronics which is anticipated to drive the demand of
global leadframe market. Leadframe are rapidly being used in
automotive sectors for variety of application purposes which is
anticipated to drive the global leadframe market. The growing use of
technology in healthcare, pharmaceutical, industrial automation is
anticipated to drive the demand and consumption of the global
leadframe market. Global leadframe market is facing challenging times
due to the sluggish growth in automotive sector which is one of the
leading contributor of the leadframe demand.
The opportunity for
the global leadframe market lies in rapidly growing consumer
electronics and telecommunications. Growing urban population,
increasing per capita expenditure and better-quality lifestyle
anticipations of middle income population group is expected to be the
key factor, depending on which global leadframe market to unfold huge
opportunity and growth.
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The global leadframe
market is segmented on the basis on the basis of manufacturing
process, layer, application and geography. On the basis of
manufacturing process the global leadframe package is segmented into
photo etching, stamping and others. The selection of the
manufacturing process is based on the volume of production. Photo
etching is primarily used for low and medium range of production
volumes. The high volume production are preferred by stamping
process. On the basis of layer the global leadframe market is
segmented as single layer leadframe, Dual layer leadframe and
multilayer leadframe, On the basis of application the global
leadframe market is segmented into consumer electronics equipment,
commercial electronic equipment, industrial electronics equipment,
automotive and others.
On the basis of
geography the global leadframe market is segmented into segmented
into North America, Europe, Asia Pacific (APAC), the Middle East and
Africa (MEA) and Latin America. Asia Pacific is anticipated to be
major market in terms of volume and value for the global leadframe
market. The strong demand in Asia pacific regions especially in
China, Japan and Korea due to its extensive electronics equipment
manufacturing practices is anticipated to contribute highly in the
global leadframe market. Followed by Asia North America is
anticipated to be the leading market for the global leadframe market
primarily driven by large and rapidly growing consumer base. The
Europe is also anticipated to be a significant contributor especially
driven by growth in leadframe application sectors such automotive and
industrial automation equipment manufacturing practices. The Middle
East and Africa is anticipated to show the sluggish growth which over
the forecasted period.
Some of the Key
Participants of the global
leadframe market are NINGBO HUALONG ELECTRONICS CO.,LTD., Wasion
Group Holdings Limited., Kangqiang Electronics Co., Ltd, Ningbo
Kangqiang Micro-Electronics Technology Co.,Ltd, Sumitomo Metal Mining
Co., Ltd., Hitachi Cable, Ltd., Kitsuda Sdn. Bhd., Veco B.V, Mitsui
High-tec, Inc., SHINKO ELECTRIC INDUSTRIES CO.,LTD., STATS ChipPAC
Ltd., Amkor Technology and others.
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