Die bonding, alternatively known as die attaching is the process of
bonding or attaching a chip either to a package or to some substrate.
Thus, die bonder equipment is used extensively in the fabrication
process of semiconductor devices. Die bonder equipment performs
various functions including picking the die from waffle tray or wafer
and attaching it to the substrate. The most commonly used technique
of die bonding is to push the targeted die from the tape with the
help of a pin. Die bonding process is accomplished by using various
techniques including eutectic bonding, soldering, adhesive bonding
and glass /silver-glass bonding. The market of die bonder equipment
market across the globe is expected to experience a stable growth
during the forecast period from 2017 to 2025 owing to the rapid
growth of the semiconductor industry.
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Rising demand of semiconductor ICs (Integrated Circuits) is one of
the most important factor anticipated to accelerate the demand of die
bonder equipment in the coming years. Increasing demand of electronic
systems with the expanding number of various end-use applications is
the key factor anticipated to provide the stimulus for rising demand
of ICs. This in turn is expected to trigger the market growth of die
bonder equipment across the globe. Additionally, emerging market for
latest technologies such as Internet of Things (IoT), UHD TVs (Ultra
High Definition Television) and hybrid laptops is further expected to
propel the demand for semiconductor ICs in the coming years, which in
turn is predicted to fuel the requirement of various die bonder
equipment. Moreover, increasing trend towards automation in
automobiles is another important factor anticipated to generate huge
demand of ICs required for various functions such as ABS, airbag
control, GPS, car navigation and display, power doors and windows and
automated driving among others. This in turn, is expected to propel
the need for innovative and advanced packaging techniques such as die
bonders.
In order to provide a complete and exhaustive analysis of the market,
the global die bonder equipment market has been segment on the basis
of product type and end user. Based on different types of die bonder
equipment available in the market, the market has been classified
into fully automatic die bonder equipment and semi-automatic die
bonder equipment. In addition, data related to application of die
bonder equipment across various end user segments including IDMs
(Integrated Device Manufacturers) and OSAT (Outsourced Semiconductor
Assembly and Test) is highlighted in this report. Moreover,
information related to current market trend along with future
expected growth trend of all the above mentioned product type and end
user segment across different regions including North America, Asia
Pacific, Europe, Middle-East and Africa (MEA) and Latin America is
also provided in this report.
Among the different end user industry, demand of die bonder equipment
from the OSAT (Outsourced Semiconductor Assembly and Test) segment
held the largest market share in 2016 and is predicted to maintain
its lead in the coming eight years. Factors such as constant
technological innovations and increasing requirement for rise in
production capacity of ICs in semiconductor packaging, is anticipated
to contribute towards the growth of this segment in the coming years.
Geographically, Asia Pacific region dominated the overall die bonder
equipment market in 2016 and is expected to maintain its dominating
position in the coming years both in terms of market share and
growth. Wide concentration of IC manufacturers in this region is the
primary factor anticipated to create huge demand of die bonder
equipment in Asia Pacific region. Moreover, growing production of
tablets, smartphones and other electronic devices is also expected to
fuel the demand of die bonder equipment in the coming years.
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Some of the major players operating in the die bonder equipment
market includes ASM Pacific Technology (Netherlands), Kulicke &
Soffa (Singapore), Palomar Technologies (The U.S) and DIAS Automation
(Hong Kong) among others.
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