Antistatic
packaging is used for shipping products, which are prone to
damage caused by electrostatic discharge. These bags are usually made
from Polyethylene Terephthalate (PET), and have a distinctive color
(silvery for metalized film, pink or black in case of polyethylene)
depending on their properties. Hence, an antistatic bag is a shipping
bag which cannot be affected by electrostatic discharge.
Electrically, antistatic bag provides lubricity within the bag,
thereby inhibiting static charge build up. These bags are typically
coated with topical antistatic agents that help reduce the generation
of static imbalance resulting from triboelectric generation or
contact and separation. Some antistatic bags are made with an
antistatic built into the film layers and tend to be more reliable
and cleaner then the topically treated ones. A good bag has
antistatic properties on both, the inner and outer part of the bag
film construction.
Major growth drivers
for the antistatic packaging market include increasing shipments of
electronic devices across the world. Antistatic packaging is mainly
used for packaging of electronic devices. This increase in usage of
electronic devices is being witnessed all over the world and in
almost all end use sectors, such as medical and household.
Antistatic packaging
market can be classified on the basis of product type into: bubble
bags, polybags, foam, polytubing, peanuts, antistatic tape, and
antistatic stretch wrap. The antistatic bubble bag is made up of low
density polyethylene, and is available in the usual packaging form.
In addition to their antistatic properties, these bags facilitate the
necessary separation of parts during transportation and storage.
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Meanwhile,
antistatic foam protects the product components from shock vibration
and other impacts. Antistatic pink bubble roll wraps are bulky items,
used for transport, and lining shipping cartons and envelopes.
In terms of region,
Korea, Singapore and China are the major manufacturers of electronic
devices and components and, hence, Asia Pacific is anticipated to
account for a major chunk of revenue generated in the antistatic
packaging market. The Asia Pacific market is anticipated to be
respectively followed by Europe and North America (majorly, the
U.S.). Meanwhile, the top electronic components and integrated
circuit exporters are located in China, Singapore, Hong Kong,
Republic of Korea, European countries and the U.S..
Key Players
in the antistatic packaging market include Edco Supply Corporation
(U.S.), Miller packaging (U.S.), Desco Industries Inc. (U.K.), Dou
Yee (China), Dakla Pack (Netherlands), Polyplus Packaging (U.K.),
Pall Corporation (U.S.), TIP Corporation (Malaysia), Kao Chia
(Taiwan), MK Master, and Advance Packaging (U.S.).
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