Wafer Level Package
(WLP) is a type of packaging used in the semiconductor industry for
the packaging of Integrated Circuits (ICs) as it is very fragile in
nature and highly susceptible to contamination, which can lead to
improper working of the IC. WLP finds application in the ICs used in
portable consumer electronic devices; for instance, smart phones.
Increasing consumer demand for technologically advanced mobile
devices that are capable of performing an array of functions in a
single small-end product is a major factor propelling demand for
wafer level packaging technology as compared to the conventional mode
of packaging in case of semiconductors, thus boosting growth of the
market for wafer level package dielectrics further. Comparatively,
the low cost associated with the wafer level packaging as compared to
the conventional packaging technology used in case of semiconductor
packaging is also a major factor expected to boost growth of the
market for wafer level package dielectrics over the forecast period.
The Wafer
Level
Package
Dielectrics
Market
is expected to expand at a healthy CAGR over the forecast period, and
the major driving factor responsible for growth of the wafer level
package dielectrics market is the rising demand for compact
electronic devices with high performance and cost effective packaging
in the semiconductor packaging industry. In case of conventional
packaging, such as die level packaging, with the variation in size of
the ICs, the cost of packaging becomes more as compared to the
production cost of the ICs. On the contrary, wafer level packaging is
much more cost-efficient as compared to the conventional packaging or
the production cost of the ICs. The technological advancements in IC
design & production are also, to an extent, propelling growth of
the wafer level package dielectrics market currently. The wafer level
packaging technology has certain perks over the traditional packaging
technology, such as minimized electricity consumption and long
battery life in case of mobile phones, and its compactness helps
manufacturers design and develop ultra-thin mobile phones. However,
fluctuations in some of the physical properties of the technology,
such as the coefficient of thermal expansion of the materials of
wafer with respect to the material of ICs, are considered as a
drawback of the wafer packaging technology, which in turn might
restraint growth of the market for wafer level package dielectrics.
The global wafer
level package dielectrics market is segmented on the basis of type of
wafer level packaging, application, and region. On the basis of type,
the global market for wafer level package dielectrics is segmented
into FOWLP (Fan-Out Wafer Level Package), FIWLP (Fan-in Wafer Level
Package), FIWLCSP (Fan-in Wafer Level Chip Scale Package), flip chip,
and 3DFOWLP. On the basis of applications, the global market for
wafer level package is segmented into consumer electronics,
automotive, aerospace, defense, and healthcare.
On the basis of
geography, the global rigid plastic packaging market is segmented
into seven key regions, namely North America, Latin America, Western
Europe, Eastern Europe, Asia Pacific, Japan, and the Middle East &
Africa. Among the aforementioned regions, the Asia-Pacific market is
projected to grow at a promising CAGR, which is attributed to the
increase in demand for smart phones globally. For instance, recently,
India become the second largest user of smart phones globally,
beating the U.S. This is turn is expected to drive growth of the
wafer level package dielectrics market in the country. Moreover, the
presence of leading semiconductor manufacturers, such as Taiwan
Semiconductor Manufacturing, among others, is expected to have a
positive effect on growth of the wafer level package dielectrics
market in APEJ over the forecast period.
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Some of the Major
Players identified in the global
wafer level package dielectrics market include ChipMOS TECHNOLOGIES
INC., STATS ChipPAC Ltd., IQE PLC, Amkor Technology Inc., TriQuint
Semiconductor Inc., Deca Technologies, KLA-Tencor Corporation,
Siliconware Precision Industries Co. Ltd., China Wafer Level CSP Co.
Ltd., and Jiangsu Changjiang Electronics Technology Co. Ltd.
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