Organic substrates
are used as base materials in semiconductor applications and
manufacturing. Unlike inorganic substrates, the organic substrates
are made of organic small molecules or polymers. Organic small
molecules are polycyclic aromatic compounds, such as pentacene,
anthracene, and rubrene. Packaging materials are not only used for
mechanical or environmental safety, but they also act as electrically
conductive interconnect between semiconductors and PCBs. Organic
packaging materials, similar to other packaging materials, also
facilitate heat distribution, signal distribution, manufacturability
and serviceability, and power distribution. They vary in
functionality and dimensions. Various packaging technologies are used
for packaging such as Small Outline Packages (SOP), Quad Flat
packages (QFP), Dual In-line package (DIP), leadless chip career, pin
grade array, ball grid array, quad flat no-leads packages, chip
scale, system in package, 2.5 D integrated circuits, and 3D
integrated circuits. Mobile phones, Flat Plate Displays (FPDs), and
consumer electronics are the major application areas of organic
substrate packaging.
Factors such as the
huge demand for Organic
Substrate Packaging Materials in system configuration and
integration and the corresponding cost benefits offered by the
materials in the end use market are expected to propel growth of the
global organic substrate packaging material market during the
forecast period. Currently, it has been witnessed that the demand for
semiconductor packaging is increasing in view of the rise in demand
for portable electronic devices. Increase in disposable income of
consumers in emerging countries, coupled with some of the innovative
key technological developments witnessed globally, is driving growth
of the end use market of organic substrates, i.e. the electronics
industry. Organic substrate is the largest segment of the
semiconductor plastic packaging material market. As there is an
increasing consumer trend towards seeking lower cost solutions, other
segments are encountering lower revenue growth. Meanwhile,
availability of a cheaper alternative can be a major threat for
growth of the global organic substrate packaging material market. The
organic substrate packaging material market is expected to expand at
a low to moderate single digit CAGR in the coming years.
The organic
substrate packaging material market is segmented by technology and by
application. Based on technology, the market is segmented into SO
packages, GA packages, Flat No-leads packages, DIP, QFP, and others.
Based on application, the market is segmented into mobile phones,
FPD, and other consumer electronics. The consumer electronics
industry is continually growing and evolving, and considering the
recent key developments in the industry, is projected to expand at a
faster growth rate in the coming years,.
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By geography, the
organic substrate packaging material market is segmented into North
America, Europe, Asia Pacific (APAC), the Middle East and Africa
(MEA), and Latin America. It has been observed that Asia-Pacific is
the most organic substrate packaging material market currently, owing
to the higher demand for the packaging material in China and Japan.
Some of the Key
Players in the global organic substrate packaging material market
are Ajinomoto Group, Amcor, ASE Kaohsiung, Mitsubishi Gas and
Chemical, SPIL, STATS ChipPAC.
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