Transparency
Market Research (TMR), A Market Intelligence And Research Firm, Has
Published A Research Study On "Semiconductor
Packaging Material Market".Semiconductor
packaging materials refer to materials that are used for the
protection of electronic components such as semiconductors and
integrated circuits (ICs) from corrosion, external collision, and
other harmful factors. The use of a host of advanced technologies on
global semiconductor packaging materials market enables efficient and
secure packaging of semiconductors and integrated circuits.
In present times,
the burgeoning use of mobile communication devices such as tablets
and smartphones is one of the major factors driving the semiconductor
packaging material market. The functioning of these devices is based
on a complex network of numerous semiconductors integrated for
sending and receiving signals, which is the basis of communication
for the devices. Thus, with the continued growth of the mobile
devices market, the demand for semiconductor packaging materials will
be on the rise in the coming years.
Currently, Asia
Pacific is a major hub of the semiconductor packaging material
market. The presence of some of the largest electronic corporations
in the world in the region accounts for the large and
well-established presence of the semiconductor packaging material
market in Asia Pacific.In some of the countries in Asia Pacific, such
as China, Indonesia, and India, the emerging middle class, which has
a handsome chunk of disposable income to spend, is generally
impulsive in its buying habits. Middle-class consumers readily trade
old electronic devices for newer gadgets, which is consistently
driving demand for electronic components for these devices. Thus, the
semiconductor packaging material market is benefitted in the region.
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Among the regional
markets for semiconductor packaging materials, Europe and North
America follow Asia Pacific in terms of revenue. Europe and North
America exhibit similar conditions in the semiconductor packaging
material market. In North America, the U.S. is one of the largest
markets for semiconductor packaging materials, with the U.S. economy
recovering in recent years to reach close to the pre-recession
economic levels.In Europe, Germany holds the largest market share in
the semiconductor packaging material market, trailed by Italy,
France, and the U.K.
Semiconductor
packaging materials are of eight types, namely bonding wires, die
attach materials, encapsulation resins, solder balls, leadframes,
organic substrates, ceramic packages, and thermal interface
materials. Currently, organic substrates comprise the largest product
segment of the global market for semiconductor packaging materials.
As a standard, bonding wires have been used for semiconductor
packaging, but the trend is shifting towards copper bonding wires as
observed in the recent past. However, the encapsulation resins
segment of the market is expected to display strong growth in the
semiconductor packaging material market due to their novelty and
various benefits over other packaging materials.
On the basis of
application, the use of semiconductor packaging materials is
application-specific and adheres to certain standard specifications
followed across the globe. Some of the packaging technologies used
around the world are GA, QFN, QFA, SOP, DFN, and others
that are dependent on the end use.Some of the companies that have a
significant presence in the global semiconductor packaging material
market are Hitachi Chemical Co. Ltd., Henkel AG & Company,
Alent plc, BASF SE, Sumitmo Chemical Co. Ltd., and Kyocera Chemical
Co. Ltd. amongst others.
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