Transparency Market
Research Added A New Report "Semiconductor
and IC Packaging Materials Market". Semiconductor and IC
Packaging materials are used to guard the electronics components like
IC’s and semiconductors from corrosion and external impact. These
materials are used along with the several advanced packaging
technologies for the packaging of IC’s and semiconductors. The
packaging material performs the final stage of semiconductor device
fabrication by placing the boards or dies inside the protective
package to provide the pins or connectors for connection.
In the span of four
years i.e. from 2010 to 2014, product development was the main growth
approach adopted by the IC’s and semiconductor packaging materials
industry. In the first six months of 2013, the Henkel AG has
completed four products. Further, the company was acquired by Hitachi
Chemical Co. Ltd., and the expansion has been done by Henkel AG &
Company and Hitachi Chemical Co. Ltd. collectively. Atotech
Deutschland and Sumitomo Chemical Co. Ltd. are the further key
participants in the development activities during this period. The
other active players in market development of IC’s and
semiconductor packaging materials are Indium Corp. and Shinko
Electric Industries Co. Ltd.
Some of the factors
driving the growth of semiconductor & IC packaging materials
market include increase in the research and development efforts to
make the electronic packaging materials highly resourceful, the
enormous demand from the electronic component companies due to
amplified population that finds electronic packaging materials useful
in a myriad of applications. The materials are well perceived in
various dominant end-user markets in the last few decades, and are
expected to be used for diverse applications in the future
The semiconductor &
IC packaging materials market is segmented on the basis of its types
which include solder balls, organic substrates, leadframes, bonding
wires, encapsulation resins, die attach materials, ceramic packages,
thermal interface materials and others (mold compounds). These
materials are produced with numerous types of packaging technologies
which includes SP, power QFN, DFN and GA. Organic substrate segment
contributes the most in the global market and is extensively used as
foundation materials for the packaging of Integrated Circuits (IC’s)
and semiconductors. The bonding wire segment mostly of gold has been
generally used as packaging materials, but recently there has been a
change towards copper bonding wires. Encapsulation resin segment is
comparatively new types of packaging materials for IC’s and
semiconductors and due to this the segment is expected to grow
aggressively in the next five years. In addition, the market could be
segmented on the basis of geography which includes North America,
Europe, Asia-Pacific and RoW.
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Some of the Key
Players that are dominating this market are Alent PLC,
Kyocera Chemical Co. Ltd., Hitachi Chemical Co. Ltd., LG Chemical
Ltd., Basf SE, Sumitomo Chemical Co. Ltd., Henkel Ag & Company,
Mitsui High-Tec Inc., Tanaka Holdings Co. Ltd. and Toray Industries
Corporation among others.
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